A brief summary of some aspects of the CoolingLogic™ technology. CoolingLogic™ incorporates methods of operating Heating, Ventilation and Air Conditioning (HVAC) systems, that can be compared to artificial intelligence for HVAC systems. It is our hope that this brief summary will provide a quick and easy overview of some of the sophisticated and mathematically complex algorithms and processes that make up CoolingLogic™.
It’s important to note that while this summary focuses on certain aspects of the CoolingLogic™ technologies, it certainly does not cover all aspects of the technologies.
A brief summary of CoolingLogic™ may be viewed by clicking on this link.
The unscripted and narrated CoolingLogic™ video provides engineers with a brief overview of CoolingLogic™. The presentation is simply an overview, and is not intended to replace the other CoolingLogic™ documents, but rather to compliment those documents by providing salient information about CoolingLogic™. Because it seems like we’ve been moving 1,000 miles per hour with our work, and because there has been so much to do lately, we didn’t script the presentation, besides what is written on the slides. Such as this is the case, there may be some minor mistakes and the presentation may be a little slow-going, however, we are very proud of how this presentation turned out, in general. There are two different quality presentations, which both have the same content.
The higher quality presentation may be played by clicking on this link.
The lowwer quality presentation may be played by clicking on this link.
The CoolingLogic™ White Paper provides in-depth engineering and market calculations, considerations and analysis. We know the value of CoolingLogic™. The white paper was written to express and mathematically prove that value to those who are engineers and/or are in the HVAC industry. Click on the link or the image to view the CoolingLogic™ White Papaer!.
If "the Devil is in the detail", then you'll need to read the claims on this patent. This is the first issued patent on the CoolingLogic™ technology. We've had subsequent filings since this disclosure was submitted to the USPTO. We've covered our bases by filing a PCT on the disclosure, so we're all set with international protection, for the time being. This patent is not the most-ideal "AI" referenced throughout; however, it is a useful and valuable invention which is protected. Subsequent filings do a much better job of "locking up" the CoolingLogic™ technology. Click on the link or the image to view Patent #: US 9,447,985 B2!.
The Continuance In Part (CIP) filed with the USPTO is pretty amazing; however, it's not exactly easy to understand. To understand the relevance of the CIP, one needs to give careful consideration to the White Paper (above) and be expert at both physics and thermal dynamics. Some engineers take days to understand the relevance of certain variables in the disclosure. Since we've put this on the WWW anyway, please feel free to call if you have any questions.
Having made the case that it's completely "normal" for a very gifted person to have trouble understanding and fully grasping both the relevance and concepts contained in the CIP, it's important to note that this filing is very special because there is so much content, rather than simply "fluff". While reading other patents to get background relating to how patents are typically written, we found that most patents are loaded with "fluff", while with this CIP, there is very little "fluff". It's solid, useful disclosure, with practically no "fluff". We didn't set out to write a CIP with the goal of eliminating "fluff", we just ended up having much, much less "fluff" in the filing because there was so much content that we had a hard enough time just including all of the content. There is so much content, in fact, that this one filing will likely end up being broken down into half a dozen or so divisional patents but, as one skilled in that art will recognize, we've protected our works by filing this disclosure.
During your review of the CoolingLogic™ technology, you might be asking yourself, "why are you disclosing a filing that has not yet been approved?" This is a good and reasonable question to ask, and I hope that this answer is impressive to you; we are disclosing the CIP because (1.) we've already filed a PCT, protecting the invention internationally, and (2.) we are that confident that this technology is novel. Everything that we have done with the first filing has produced subsequently encouraging results. We got "flying colors" on two independent prior art searches, we've had several very experienced HVAC professionals & engineers verify that the idea was novel (average experience of the professionals being 30 years in the industry), we passed examination review of the first patent with absolutely no hiccups, and the CIP is based on the first, issued, patent.
We are filing an amended claim-set on the CIP, so the document shown by the link only contains the original filing. Our amended claim-set has many, many claims. As negotiations proceed, full disclosure may be arranged. Click on the link or the image to view the first CIP of patent # US 9,447,985 B2!.
If you've reading this, then it's likely that you may have been contacted by us. If this is the case, then you may have already received a letter like this from us. This is my letter to you. We're not big enough to fully utilize this amazing invention, and quite frankly, we need a vacation because we've been working very hard for a long time. We'd like to sell the rights to the CoolingLogic™ technology. Click on the link or the image to view my message to you!.